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Samsung reportedly plans to join UALink Alliance — high-speed interconnect could power its next-gen chips

Samsung reportedly plans to join UALink Alliance — high-speed interconnect could power its next-gen chips


Samsung reportedly plans to join UALink Alliance — high-speed interconnect could power its next-gen chips

Samsung has expressed interest in joining the UALink Alliance, which aims to create new interconnect standards for various accelerators, according to DigiTimes. The report suggests that the plan is designed to boost Samsung’s foundry business, allowing it to better address its customers’ needs. However, Samsung could also develop its own accelerators and connect them using industry standard technology.

At the Samsung Foundry Forum (SFF) 2024, TaeJoong Song, who leads business development at Samsung’s foundry division, indicated that Samsung is intrigued by UALink’s efforts to standardize AI chip interconnectivity. He mentioned that Samsung is exploring ways to support and possibly join the alliance.

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